Method of testing memory card operation

ABSTRACT

A system and method are disclosed for testing operation of a memory card within an electronic host device. The system includes a flat flexible cable, or strip, for electrically coupling between the memory card slot in a host device and a test assembly. The test assembly may have a card slot for accepting an external memory card, and a debug header for receiving a cable connected to a debug apparatus such as a logic analyzer and/or an oscilloscope.

CROSS-REFERENCE TO RELATED APPLICATIONS

The following application is cross-referenced and incorporated byreference herein in its entirety:

U.S. patent application Ser. No. 11/693,648, entitled “EXTENDER STRIPAND TEST ASSEMBLY FOR TESTING MEMORY CARD OPERATION,” by Alan Chiou etal., filed concurrently herewith.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the present invention relate to a system and method oftesting operation of a memory card with an electronic host device.

2. Description of the Related Art

The strong growth in demand for portable consumer electronics is drivingthe need for high-capacity storage devices. Non-volatile semiconductormemory devices, such as flash memory storage cards, are becoming widelyused to meet the ever-growing demands on digital information storage andexchange. Their portability, versatility and rugged design, along withtheir high reliability and large capacity, have made such memory devicesideal for use in a wide variety of electronic devices, including forexample digital cameras, digital music players, video game consoles,PDAs and cellular telephones.

There is an ever-present push to provide greater device capability in asmaller form factor. As a result, some devices have had to resort topositioning the memory card slot somewhere within the interior of thedevice. For example, as shown in prior art FIG. 1, in order to providethe most compact form factor, some cellular telephone manufacturers haveresorted to providing a telephone 20 having a memory card slot 22positioned beneath a cover 24. It is also known in cellular telephonesand other electronic devices to position the memory card slot 22 beneaththe battery slot. Thus, both the cover and battery must be removed toallow access to the memory card slot 22. Still other electronic deviceshave the memory card slot positioned elsewhere within the interior ofthe device so as to be generally inaccessible when the device isassembled and operational.

One drawback to having the memory card slot positioned within theinterior of the device is that it is not accessible to test equipmentused to test the operation of the memory card, electronic device and/orthe exchange of signals therebetween. In particular, prior to a devicemanufacturer shipping a line of electronic devices, the manufacturerwill typically perform fault testing on one or more of the devices. Thisfault test may include transferring data between the portable memorycard positioned within the card slot 22 and the electronic device toensure proper data transfer. The testing equipment may include adebugging apparatus, such as a logic analyzer and/or an oscilloscope, sothat, when a problem is detected, the fault may be debugged and thespecific source of the problem identified.

Such testing operations are carried out by connecting to the signalcontact pads in the memory card slot of the host device and testing thedevice during its normal operation. However, with designs where thememory card slot is enclosed within the housing, for example buriedbeneath the battery and/or cover, it is not possible to access thememory card slot in order to perform the fault testing.

SUMMARY OF THE INVENTION

The present invention, roughly described, relates to a system and methodfor testing operation of a memory card with an electronic host device.The present system is particularly useful for testing a host devicehaving a memory card slot buried beneath a cover and possibly one ormore other host device components when the host device is operational.The system includes a flat flexible cable, or strip, for electricallycoupling between the memory card slot in a host device and a testassembly. An end of the strip may include contact pads for mating withthe contact pads within the host device card slot. The same end mayfurther include a rigid member for ensuring proper alignment and contactbetween the strip contact pads and the card slot contact pads. Inembodiments, the rigid member may be the same size and shape as a memorycard for which the host device memory card slot is configured.

The opposite end of the strip may be connected to the test assembly. Thetest assembly may have a card slot of accepting an external memory card,and a debug header for receiving a cable connected to a debug apparatussuch as a logic analyzer and/or an oscilloscope. In embodiments, theexternal card slot on the test assembly may be configured to accept thesame or different type of memory card as the host device card slot.

In operation, once all components are connected, signals may beexchanged between the host device and the external memory card pluggedinto the test assembly. The debug header may extract signals sent fromthe host device to the external memory card. Those signals may betransferred to the debugging apparatus, which can then analyze theintegrity of the respective signals. Thus, according to the presentinvention, the operation of a memory card with the host device, and theexchange of signals between the host device and a memory card, may betested and debugged even though the memory card slot is inaccessiblewhile the host device is operational.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a conventional electronic device havinga memory card slot buried beneath the device cover and possibly one ormore additional components.

FIG. 2 is a perspective view of an electronic device together with astrip and test assembly according to the present invention.

FIG. 3 is a bottom view of the strip and a portion of the test assemblyaccording to the present invention.

FIG. 4 is a perspective view of a strip according to the presentinvention having an end affixed within the memory card slot of theelectronic device.

FIG. 5 is a perspective view of a first end of a strip according to thepresent invention affixed within a sealed electronic device and a secondend of the strip affixed to a test assembly.

FIG. 6 is a perspective view as in FIG. 5, with an external memory cardand debug apparatus cable affixed to the test assembly.

FIG. 7 is a flow chart of the assembly and operation of an embodiment ofthe present invention.

FIG. 8 is an electrical schematic diagram of test assembly according tothe present invention.

DETAILED DESCRIPTION

Embodiments will now be described with reference to FIGS. 2 through 8,which relate to a system and method of testing operation of a memorycard with an electronic host device. It is understood that the presentinvention may be embodied in many different forms and should not beconstrued as being limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete and will fully convey the invention to those skilled in theart. Indeed, the invention is intended to cover alternatives,modifications and equivalents of these embodiments, which are includedwithin the scope and spirit of the invention as defined by the appendedclaims. Furthermore, in the following detailed description of thepresent invention, numerous specific details are set forth in order toprovide a thorough understanding of the present invention. However, itwill be clear to those of ordinary skill in the art that the presentinvention may be practiced without such specific details.

Referring initially to the exploded perspective view of FIG. 2, there isshown an electronic device 100 including a memory card slot 102 providedwithin the interior of device 100. Device 100 may be any of a variety ofelectronic devices including a slot for receiving a memory card. Suchdevices include, but are not limited to, cellular telephones, digitalcameras, digital music players, video game consoles, PDAs, and handheldcomputers. Card slot 102 may be of a type to receive any of a variety ofknown memory card configurations, such as for example a micro SD memorycard, manufactured by San Disc Corporation, Milpitas, Calif. Card slot102 may be accessible upon removal of a cover 104. It is contemplatedthat card slot 102 may be buried beneath one or more additionalcomponents of host device 100, such as for example a battery poweringdevice 100.

Referring now to the perspective view of FIG. 2 and the bottom view ofFIG. 3, a flexible electrical connector, or strip, 110 may be providedin accordance with the present invention having a first end 112 and asecond end 114 opposite end 112. Flexible strip 110 may be flat flexiblecable (FFC), and may include a plurality of electrical traces 116laminated within an insulator such as for example polyester. It isunderstood that the insulator may be other than polyester in alternativeembodiments of the present invention. The number of traces laminatedwithin electrical strip 110 may match the number of contact pads withincard slot 102. It is understood that the number of traces within strip110 may be less than or greater than the number of contact pads in cardslot 102 in alternative embodiments. The flexible strip 110 may have awidth of for example be one-third of an inch to two-thirds of an inchand may include electrical traces having a pitch of 0.5 millimeters. Thewidth of strip 110 may be less than one-third inches and greater thantwo-thirds inches, and the pitch may be less than or greater than 0.5millimeters, in alternative embodiments. Flexible strip 110 may have asubstantially flat profile so as to be able to extend from the interiorof device 100 to the exterior of device 100 when the device is fullyassembled with cover 104 affixed in position on device 100.

End 112 of strip 110 may include exposed electrical contact pads 118 formating with the contact pads within card slot 102. Similarly, end 114may include exposed electrical contact pads 120 for mating withconnector pins in a testing apparatus as explained hereinafter.

First end 112 may further include a rigid member 124 mounted to strip110 on a side of strip 110 opposite that including exposed contact pads118. Rigid member 124 may be mounted using a known adhesive, have forexample low outgassing and wear properties over time. Rigid member 124is sized to fit within card slot 102 and is provided to facilitatecontact between contact pads 118 on strip 110 and the contact padswithin card slot 102.

In an embodiment, rigid member 124 may have the same footprint and shapeas the memory card for which card slot 102 is configured. Thus, wherecard slot 102 accepts a micro SD card, rigid member 124 may have theoutline of a micro SD card (as shown for example in FIG. 3). It isunderstood that rigid member 124 may have other shapes in alternativeembodiments, with the provision that rigid member 124 ensure a properalignment and contact of contact pads 118 with the contact pads withinthe card slot 102. Rigid member 124 may be formed of any of variousrigid, electrically insulative materials, such as for examplepolycarbonate and other plastics. In an alternative embodiment, it ispossible that rigid member 124 may be formed of metal or anotherconductor, where the adhesive used to affix rigid member 124 to strip110 is an electrical isolator.

The length of strip 110 (the distance between end 112 and end 114) mayvary in alternative embodiments of the present invention, and may forexample be between a half inch and four inches, and in furtherembodiments be between one and two inches. It is understood that thelength of strip 110 may be shorter than one half inch and longer thanfour inches in further embodiments of the present invention.

End 114 of strip 110 may mate with a connector 130 in a testing assembly132. Such connectors are commercially available for example from MolexCorp. having headquarters in Lisle, Ill. Test assembly 132 includes anexternal card slot 134 for receiving an external memory card asexplained hereinafter. Test assembly 132 includes a debug header 136connecting the test assembly 132 to a debugging apparatus, such as forexample a logic analyzer or an oscilloscope (not shown) as are known inthe art. End 114 of strip 110 may be a ZIF (zero insertion force)connector for mating within connector 130. Connector 130 connects thesignal traces within strip 110 both to respective contact pads withinexternal card slot 134, and with electrical terminals of debug header136.

Referring now to FIG. 4, the rigid member 124 affixed to strip 110 maybe inserted into card 102 in host device 100. Member 124 ensures properalignment and contact between contact pins 118 in strip 110 and thecontact pads within the slot 102 of host device 100. It is understoodthat rigid member 124 may be omitted in alternative embodiments andother mechanisms be provided (as part of strip 110 and/or within slot102) to ensure proper alignment and contact of contact pins 118 with thecontact pads within the card slot 102. When end 112 of strip 110 isconnected within card slot 102, and end 114 of strip 110 is connected tothe test assembly 132, the electrical traces 116 within strip 110communicate electrical signals between the host device and the testassembly.

Referring now to the perspective views of FIGS. 5 and 6, once the end112 of strip 110 is mated within slot 102, the cover 104 as well as abattery or any other components may be assembled onto the host device toenable operation of the host device 100. As strip 110 is flat andflexible, it can bend as necessary so that end 112 remains seated withinslot 102 while opposite end 114 extends outside of the sealed hostdevice 100.

As is also shown in the perspective views of FIGS. 5 and 6, externalcard slot 134 of test assembly 132 may receive an external memory card140, and debug header 136 may accept a cable 142 connecting testassembly 132 with one or more debug devices such as a logic analyzerand/or an oscilloscope.

Memory card 140 may be the same type of memory card that is acceptedwithin slot 102 within host device 100. In alternative embodiments,external memory card 140 may be different than the memory card acceptedwithin card slot 102 in device 100. Thus for example where slot 102 isconfigured to receive a micro SD card, slot 134 may be configured toreceive a mini SD card, an SD card or a variety of other memory cards.Additionally, slot 134 may accept an adapter which would allow a singleslot 134 to operate with any of a variety of different configurations ofexternal memory card 140.

The operation of the present invention will now be described withreference to the flow chart of FIG. 7. In step 200, first end 112 offlex strip 110 is inserted into card slot 102 within host device 100.Cover 104 and any other components are removed as necessary to allowinsertion of rigid member 124 in the card slot 102. In a step 202, hostdevice 100 may be assembled into an operational configuration. This mayinclude replacing a battery or other component over the internal cardslot 102, and affixing the cover 104 in position on device 100.

In a step 204, second end 114 may be inserted into test assembly 132. Anexternal memory card 140 may then be inserted into external card slot134 in a step 206. In step 208, the debug cable 142 may be affixed todebug header 136. In alternative embodiments of the invention, step 208may be skipped and no debug apparatus affixed to test assembly 132. Insuch embodiments, test assembly 132 and strip 110 may simply be used totest the exchange signals between an external memory card 140 and hostdevice 100.

The device may be powered on in a step 212, and signals may be exchangedbetween the external memory card 140 and the host device 100 in a step214. It is understood that the order of the above-described steps is notcritical and may be performed in a different order in alternativeembodiments. For example, step 212 of powering on the host device couldbe performed before step 204 of inserting the second end of flexiblestrip 110 into test assembly 132.

In step 216, strip 110 and test assembly 132 may be used to test anddebug the signal exchange between host device 100 and the externalmemory card 140. Thus, according to the present invention, the operationof a memory card with the host device, and the exchange of signalsbetween the host device and a memory card, may be tested and debuggedeven though the memory card slot is inaccessible while the host deviceis operational.

Step 216 is explained in greater detail with respect to the schematicdiagram of FIG. 8. Once all components are connected, signals may beexchanged between external memory card 140 and host device 100. Debugheader 136 may extract signals sent from host device 100 to the externalmemory card. Those signals may be transferred to a debugging apparatussuch as a logic analyzer and/or an oscilloscope. The debugging apparatuscan then analyze the integrity of the respective signals transferred toand/or from device 100. The logic analyzer can access individual contactpads within the host device memory card slot 102, and can accordinglylocate the source of a problem in the event the test detects a faultysignal exchange.

While embodiments of the present invention are particularly useful fortesting the exchange of signals to and/or from a host device where thememory card slot is inaccessible, it is understood that the presentinvention may also be used with a card slot which is directly accessiblefrom outside of the device. In such embodiments, the rigid member 124 onend 112 may be inserted directly into card slot 102 without having toremove cover 104 or any other components from host device 100.

While strip 110 and test assembly 132 have been described above as asystem for testing the operation of a memory card with a host device, itis understood that strip 110 and assembly 132 may have other uses infurther embodiments of the present invention. For example, in one suchfurther embodiment, the above-described set up may be used to loadsoftware and/or data from an external memory card 140 onto host device100. After the software and/or data are loaded, the above-describedassembly may be used to test the exchange of signals between device 100and external memory card 140. Alternatively, in this embodiment, thetest procedure may be omitted and strip 110 and assembly 132 simply usedto load software and/or information onto host device 100.

In the embodiments described above, rigid member 124 is used as a“dummy” memory card to facilitate the alignment and connection of firstend 112 within card slot 102 in host device 100. In a furtheralternative embodiment, rigid member 124 may in fact be an operationalmemory card affixed to strip 110 and fitting within slot 102. In such anembodiment, flexible strip 110 may not be used to transfer electricalsignals, but rather may be used as a support to facilitate automatedinsertion of the memory card into card slot 102 in device 100.

The foregoing detailed description of the invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed. Manymodifications and variations are possible in light of the aboveteaching. The described embodiments were chosen in order to best explainthe principles of the invention and its practical application to therebyenable others skilled in the art to best utilize the invention invarious embodiments and with various modifications as are suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto.

1. A method of testing an exchange of signals between an electronic hostdevice and a memory card capable of fifing within a socket in theelectronic host device, the socket including contact pads for matingwith contact pads on the memory card, the method comprising the stepsof: (a) electrically coupling a first end of an electrical lead strip tothe contact pads in the socket of the host device; (b) electricallycoupling the second end of the electrical lead strip to a memory storagedevice external to the host device; (c) transferring signals at leastfrom the host device to the external memory storage device; and (d)testing the signals transferred in said step (c).
 2. A method of testingas recited in claim 1, further comprising the step (e) of mounting thefirst end of the electrical lead strip on a rigid member.
 3. A method oftesting as recited in claim 2, said step (e) of mounting the first endof the electrical lead strip on a rigid member comprising the step ofmounting the first end of the electrical lead strip on a rigid member atleast approximating the size and shape of the memory card fitting withinthe socket of the host device.
 4. A method of testing as recited inclaim 3, said step (a) of electrically coupling a first end of theelectrical lead strip to the contact pads in the socket of the hostdevice comprising the step of plugging the rigid member into the socketof the host device.
 5. A method of testing as recited in claim 1, saidstep (b) of electrically coupling the second end of the electrical leadstrip to an external storage device comprising the step of electricallycoupling the second end of the electrical lead strip to an externalmemory card.
 6. A method of testing as recited in claim 1, said step (b)of electrically coupling the second end of the electrical lead strip toan external storage device comprising the step of attaching the secondend of the electrical lead strip to a test assembly and plugging theexternal memory storage device into the test assembly.
 7. A method oftesting as recited in claim 1, said step (d) of testing the signalscomprising the step of extracting for analysis signals transmitted fromthe host device to the test assembly memory storage device.
 8. A methodof testing an exchange of signals between an electronic host device anda memory card capable of fifing within a socket in the electronic hostdevice, the socket including contact pads for mating with contact padson the memory card, the method comprising the steps of: (a) electricallycoupling a first end of an electrical lead strip to the contact pads inthe socket of the host device; (b) electrically coupling the second endof the electrical lead strip to a test assembly external to the hostdevice; (c) supplying the test assembly with memory storage external tothe host device; (d) transferring signals at least from the host deviceto the external memory storage; and (e) testing the signals transferredin said step (d).
 9. A method of testing as recited in claim 8, saidstep (a) of electrically coupling the first end of the electrical leadstrip to the contact pads in the socket of the host device comprisingthe steps of mounting the first end of the electrical lead strip to arigid member approximating the shape of the memory card and insertingthe rigid member into the socket.
 10. A method of testing as recited inclaim 9, said step (c) of supplying the test assembly with memorystorage external to the host device comprising the step of building amemory storage device into the test assembly.
 11. A method of testing asrecited in claim 9, said step (c) of supplying the test assembly withmemory storage external to the host device comprising the step ofinserting an external memory card into the test assembly.
 12. A methodof testing as recited in claim 11, said step of inserting the externalmemory card into the test assembly comprising the step of inserting anexternal memory card which is the same configuration as the memory cardfifing within the socket of the host device.
 13. A method of testing asrecited in claim 11, said step of inserting the external memory cardinto the test assembly comprising the step of inserting an externalmemory card which has a different configuration than the memory cardfifing within the socket of the host device.
 14. A method of testing asrecited in claim 8, said step (e) of testing the signals comprising thestep of extracting the signals and testing them with at least one of alogic analyzer and an oscilloscope.
 15. In an electronic host deviceincluding a memory card mating with host device contact pads enclosedwithin the electronic host device, a method of testing the exchange ofsignals between the electronic host device and the memory cardcomprising the steps of: (a) forming a first end of an electrical leadstrip with a rigid member having a shape at least approximating thememory card; (b) inserting the rigid member into the host device to mateelectrical leads in the electrical lead strip with the contact padsenclosed within the host device; (c) coupling a second end of theelectrical lead strip to a test assembly external to the host device;(d) affixing an external memory card into the test assembly; (e)transferring signals at least from the host device to the externalmemory card; and (f) testing the signals transferred in said step (d).16. A method as recited in claim 15, said step (a) of forming a firstend of an electrical lead strip with a rigid member having a shape atleast approximating the memory card comprising the step of affixing therigid member to the first end of the electrical lead strip using anadhesive.
 17. A method as recited in claim 15, further comprising a step(g) of coupling a debugging device to the test assembly, the debuggingdevice capable of accessing individual signals transferred to and fromrespective host device contact pads.
 18. A method as recited in claim17, said step (f) of testing the signals comprising the step (h) ofusing the debugging device coupled to the test assembly in said step(g).
 19. A method of testing an exchange of signals between a mobiletelephone and a memory card capable of fifing within a socket in themobile telephone, the method comprising the steps of: (a) affixing arigid member to an end of a flexible lead strip, the rigid member havinga shape at least approximating the memory card; (b) inserting the rigidmember into the host device socket; (c) coupling a second end of theflexible lead strip to a test assembly external to the cellulartelephone; (d) supplying the test assembly with memory storage externalto the cellular telephone; (e) transferring signals at least from thecellular telephone to the external memory storage; and (f) testing thesignals transferred in said step (e).
 20. A method of testing as recitedin claim 19, wherein the memory card capable of fitting within thesocket in the mobile phone is a micro SD memory card.
 21. A method oftesting as recited in claim 19, further comprising the step (g) ofcoupling a debugging device to the test assembly, the debugging devicecapable of accessing individual signals transferred to and fromrespective contact pads of the socket within the cellular telephone. 22.A method of testing as recited in claim 19, said step (f) of testing thesignals comprising the step (h) of using the debugging device coupled tothe test assembly in said step (g).